Double-sided PCB consists conductive copper layers on both sides, allowing for more complex and denser circuitry compared to single-sided PCBs. It uses vias—small holes plated with copper—to connect circuits across both layers. This design enhances connectivity and component density without significantly increasing cost, making it suitable for moderately complex electronics. Double-sided PCBs balance simplicity, functionality, and affordability, making them popular in various applications from consumer electronics to industrial machinery.

Double-sided PCB Manufacturing processes

Step by step processes of producing double-sided PCBs, from DFM check to shipping. 

1

Engineering

Check all the data provided to make sure the designing of the PCB is manufacturable, functional, reliable and cost effective. Raise questions if EQ, then issue MI for production.

2

CCL Cutting

Cut the sheet CCL(Copper-Clad Laminate) into panels according to MI. Cutting - curium - debur.

3

Drilling

Drill on board to form through holes.

4

Desmear

Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.

5

PTH

Electroless Copper Plating, a thin layer of copper is deposited on the hole walls through a chemical process, making them conductive.

6

Panel Plating

Electroplating, the thin copper layer is further reinforced with additional copper through electroplating, ensuring robust and reliable electrical connections.

7

Pre-treatment

Prepare for the next step, D/F lamination. To increase dry film adhesion, etch the surface of copper foils by jet-scrubber, buff brushing.
8

D/F Lamination

Laminate Dry Film on copper foils. D/F is used as a photosensitive material for photolithography.

9

D/F Exposure

Apply masks(films) on D/F and expose light onto the surface of copper foils. Currently, we use both ways, D/F and LDI (Laser Direct Imaging), which doesn’t require mask application.

10

DES

Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.

11

O/L Inspection

Use AOI for outer layer inspection, to check for defects such as scratches, misalignments, and incomplete etching, ensuring the final board meets the required specification.

12

Pre-treatment

Clean and roughen the copper surface to increase the adhesion between the copper surface and solder resist

13

Solder Mask

Apply photo solder resist on one side then pre-baking, then printing solder resist on the other side, pre-baking, then exposure - develop - curing.

14

Silkscreen

Screen printing or injet printer printing the legend. 

15

Surface Finish

Apply surface treatment according to the specification, like Lead-free HASL, OSP, Immersion Gold/ Tin/Ag etc.

16

Profile

CNC routing, V-scoring, or punching, to de-panel the board from working panel. 

17

E-testing

Use Probe flying testing for prototype and small series, and E-test fixture for production orders.

18

FQA

Final Quality Control and Final Quality Assurance for the finished PCB.

19

Packing & Shipping

Packing according to the specification and deliver to wordwide customers.

Double-sided PCB Stackup

Basic stackup structure of double-sided PCB, base on different dielectric types, copper/ solder mask thicknesses, the detailed stackup can be vary.

Material Selection Guide

Comprehensive material list with key parameter details attached to help you choose the best materials for your projects.

No.TypeVendorModelBase ColorFlammability
UL94
Tg(¡æ)Td(¡æ)CTE(%)Dk/Df
(@1Ghz)
DatasheetFeature
1XPCKBKB-1150TanHB////Paper based phenolic copper clad laminates,Low cost
2FR-1KBKB-3151CTanV0////Paper-based; CTI 175V / 600V; Wide applications , flammability with UL94V-0 grade
3FR-1KBKB-3151HSTanV0////Paper-based; CTI>=600V;High thermal and insulation properties
4FR-1KBKB-3152TanV0////Paper-based; CTI¡Ý175/600V; Halogen free
522FKBKB-5152YellowV0////Paper-based; Excellent punching property
6CEM-1KBKB-5150Yellow,White,pure-whiteV0////Excellent punching property; CTI 175V/ 300V/ 600V
7CEM-1KBKB-5150AYellow,White,pure-whiteV0////Excellent punching property; CTI 175V/ 300V/ 600V
8CEM-1KBKB-5150&Yellow,White,pure-whiteV0////Excellent punching property; CTI 175V/ 300V/ 600V
9CEM-1KBKB-5150HYellow,White,pure-whiteV0////Excellent moisture and thermal resistance; CTI 300V
10CEM-1KBKB-5252NaturalV0////Halogen free; CTI 175V
11CEM-1KBKB-5150GNaturalV0////Halogen free; CTI 600V
12CEM-1SYS3110Lvory WhiteV0//6.2/Lower warpage; 400 ¡Ü CTI < 600
13CEM-1SYS3116V0//6.5/CTI¡Ý600V
14CEM-1SYQ360GV0//6.2/Halogen free; CTI¡Ý600V
15CEM-3KBKB-7150Milky-white; Natural; YellowV0///Better drilling performance than FR-4; CTI 175V/ 600V
16CEM-3KBKB-7150CMilky-white; Natural; YellowV0///Better drilling performance than FR-4; CTI 175V/ 600V
17CEM-3KBKB-7150TLight GrayV0High thermal conductivity; CTI 600V

Top Brand Suppliers We Use

Explore our major suppliers offering top-quality products. We use top brand laminate and solder mask suppliers to guarantee quality from the source.

State-Of-The-Art Equipment

Our cutting-edge technology plus morden equipments to ensures unparalleled performance and reliability for all your needs.

Value-Added Services

From quickturn prototype PCB manufacturing to Assemblied PCB, we have got you covered.

Free DFM Check

PCB Layout optimization, EQ confirmation, to improve production yield and cost reduction.

Quickturn PCB Manufacturing

As quick as 24 Hours for Prototype PCB manufacturing, small series as fast as 5~7 days.

Prototype PCB Manufacturing

No MOQ limit, PCB Prototype as less as one single piece. Even one piece we care.

HMLV Orders

Focus on High-Mix-Low-Volume PCB Manufacturing for more than 10 years.

Components Sourcing

Hard-to-find components sourcing; NRND components substitue; global network.

Quick turn PCB Assembly

24 Hours PCB Assembly upon all components secured. Medium batch as fast as 3~5 days.

Prototype PCB Assembly

Focus on High-Mix-Low-Volume PCB Manufacturing for more than 10 years.

Turnkey PCB Assembly

From PCB Manufacturing, Parts Procurement to PCB Assembly, we have got you covered.

Frequently Asked Questions

We have FR-1, CEM-1, CEM-3 and FR-4, also Aluminum and copper-based substrate. Will always follow your requirement to do.

Limited Design Complexity: Only suitable for simple circuits with low component density;
Space Constraints: Limited space for routing connections and placing components;
Performance: Not suitable for high-speed or high-frequency applications due to potential interference and signal integrity issues.

We prefer Gerber RS-274x, however other formats like ODB++(.tgz), Altium Designer(.PcbDoc), Eagle(.brd) also accepted. 

The turnaround time varies depending on the complexity and quantity of the order but typically ranges from 5 working days to a couple of weeks.

Cost-Effective: Cheaper to manufacture compared to double-sided or multilayer PCBs; Simplicity: Easier to design and produce, making them suitable for simple and low-density circuits; Repairability: Easier to repair and troubleshoot due to the single layer of circuitry.

Eagle, Altium Designer, KiCad, EasyEDA, OrCAD.

Yes, but the design must consider the current-carrying capacity of the traces and ensure adequate heat dissipation. Thicker copper layers and wider traces are often used for high-current applications.

We run visual Inspection, electrical testing and thermal testing for every board before ship, even single-sided PCB, NOT because they are simple but NOTinspection.

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