Mixed technology PCB Assembly, which is a combination of both through-hole and surface-mount technology components on the same Printed Circuit Board. This approach leverages the strengths of each technology to accommodate a variety of component types and sizes, enhancing functionality and reliability.

In a mixed assembly, SMT components are typically placed first because their assembly involves applying solder paste and then reflow soldering, processes which require high temperatures. These components are smaller, lighter, and allow for a higher density of connections. After the SMT components have been soldered, THT components are inserted into pre-drilled holes on the same board. These components are then soldered using wave soldering or manual soldering techniques, which can handle the larger, often more robust parts that may need to withstand mechanical stress – like transformers, filters, connectors, switches, and large capacitors etc.

This method especially suitable for complex devices that demand the ruggedness of THT for certain components, but also need the high circuit density and miniaturization that SMT offers. A mixed PCB assembly makes sure that the board space is utilized in the best possible way and it can be used for high-performance applications which have both high-speed SMT parts as well as high-power THT parts involved. It represents a versatile manufacturing approach, combining the best of both worlds to meet diverse electronic product requirements.